A-Tech System

UHV Sputter System with 8x3"

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Product Details

Quick Information

  • Model Number : UHV Sputter - 100M

Description



Special Features

  • Ultrahigh vacuum sputter system for R&D and small scale production (base pressure : up to ~ 10-9 Torr obtained with only mechanical & trubo molecular pumps)


  • Ferromagnetic metals proheated and predeposited in load-lock chamber


  • Substrate rotation system to be automatically positioned


  • Applications
    - Ferromagnetic materials deposition for MRAM and hard disk products

  • Wafer capacity : 7 x 3"


  • Average throughput : Up to 30,000 wafers per year


  • Dimension : 1,965L x 1,720H x 1,400W (mm3)

  • Others
    - Power : DC 500W 2ea. DC 1500W 1ea
    - Gas : Ar
    - Pump : rotary (970I/min for process chamber & 600I/min for loadlock chamber) & turbo (1,380I/s)
    - Heater : halogen lamp in loadlock chamber (max. 700°C)


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    • UHV Sputter System with 8x3" image

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