A-Tech System

UHV Sputter System with 4x3"

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Product Details

Quick Information

  • Model Number : UHV Sputter - 50F

Description



Special Features

  • Ultrahigh vacuum sputter system for R&D and small scale production (base pressure : up to ~ 10-9 Torr)


  • Pumping system equiped with ion and turbo molecular pumps


  • Predepositon process of oxides or metals in load-lock chamber


  • Automatic mask loading system


  • Permanent magnetic system installed in main chamber


  • Applications
    - Ferromagnetic materials deposition for MRAM and hard disk products
  • Wafer capacity : 4 x 3" (4 x 4")


  • Average throughput : Up to 20,000 wafers per year


  • Dimension : 1,575L x 1,720H x 930W (mm3)

  • Others
    - Power : DC 600W (13.56MHz)
    - Gas : Ar / O2
    - Pump : rotary (980I/min) & turbo (1,000I/s) ionization (500I/s)


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    • UHV Sputter System with 4x3" image

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